Signal Integrity & Power Integrity

SI/PI analysis and design to keep your high-speed signals clean and your power delivery solid.

Signal Integrity & Power Integrity (SI/PI) Design Services

A2e Technologies provides comprehensive Signal Integrity (SI) and Power Integrity (PI) analysis and design services. As data rates climb and power budgets tighten, getting SI/PI right is no longer optional — it is the difference between a board that works first spin and one that doesn't. We perform pre-layout simulation to guide stack-up and topology decisions, post-layout verification to catch problems before you spin, and full PDN analysis to ensure clean, stable power delivery to every device on your board.

Signal Integrity Analysis

  • Transmission line analysis
  • Controlled impedance design
  • Differential pair timing & skew
  • Eye diagram simulation & margin analysis
  • Reflection & ringing analysis
  • Crosstalk analysis & mitigation
  • Pre-layout topology exploration
  • Post-layout SI verification

High-Speed Interface Design

  • PCIe Gen 3 / Gen 4 / Gen 5
  • DDR4 / DDR5 / LPDDR5
  • USB 3.2 / USB4
  • 10GbE / 25GbE Ethernet
  • SERDES multi-gigabit links
  • MIPI (CSI-2, DSI, D-PHY)
  • HDMI 2.x / DisplayPort

Power Integrity (PDN) Analysis

  • Power Delivery Network (PDN) design
  • Target impedance calculation & optimization
  • Decoupling capacitor selection & placement
  • Power plane resonance analysis
  • AC impedance (|Z| vs. frequency) analysis
  • DC voltage drop (IR drop) simulation
  • Simultaneous Switching Output (SSO) noise
  • Ground bounce analysis & mitigation

VRM & Power Distribution

  • VRM (Voltage Regulator Module) design
  • Multi-rail PDN co-analysis
  • Loop bandwidth & transient response
  • Core voltage rail design for FPGAs & SoCs
  • Defense & aerospace power derating

Simulation Tools

  • HyperLynx SI & PI
  • Ansys SIwave / HFSS
  • Cadence Sigrity PowerSI
  • Keysight ADS
  • SPICE-based circuit simulation
  • IBIS / IBIS-AMI model support
  • S-parameter (Touchstone) analysis

PCB Stack-up & Routing Rules

  • Stack-up optimization for SI & PI
  • Controlled impedance trace calculations
  • Return path analysis
  • Via stub mitigation (backdrilling, blind vias)
  • Layer assignment for noise isolation
  • Split plane management
  • EMI-driven routing guidelines

We simulate it before you spin it — saving you time, money, and board re-spins.

Why Our SI/PI Work Is Better

Fewer Board Re-Spins

Pre-layout SI/PI simulation catches problems before you cut gerbers. We identify stack-up, routing, and PDN issues early — when they are cheap to fix.

First-Principles Analysis

We do not rely on rules of thumb. Every high-speed interface gets a simulation with the actual stack-up, via geometry, and component models — not a generic template.

Actionable Results

We deliver clear reports with pass/fail margins and specific, prioritized fixes — not just pretty waveforms. Your layout team gets exact constraints they can act on.

Defense & Space Grade

We routinely analyze boards for extended temperature ranges, radiation tolerance, and MIL-STD environments where SI/PI margins must hold under worst-case conditions.

Complete Documentation

You receive a full SI/PI analysis report including simulation setup, waveforms, eye diagrams, impedance plots, pass/fail summaries, and recommended design constraints.

Integrated with PCB Layout

Our SI/PI team works hand-in-hand with our PCB layout engineers so constraints flow directly into the design — no translation loss between analysis and implementation.